Joining Technologies and Corrosion  
Alloy Design & Processing Technologies
Corrosion and Local Electrochemistry
Functional Surfaces in Reactive Environments
Joining & Interface Engineering
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MICRO- AND NANO-JOINING TECHNOLOGIES

  • Development of novel joining methods for integration and assembly of micro- and nano-scaled components and devices.

  • Adaptation of conventional joining processes for integration and assembly of micro- and nano-scaled components and devices.

  • Joining with and of nanostructured materials.
 
SURFACE AND INTERFACE ENGINEERING FOR JOINING

  • Development of surface pre-treatments and metallization systems for improved wetting, capillary spreading and non-reactive brazing of metallic and ceramic components.

  • Tailoring interfacial reaction kinetics, selective compound formation, grain boundary wetting and (pre-)melting for low-temperature joining applications though smart interfacial design.
 
NANO-FILLERS FOR LOW-TEMPERATURE JOINING METHODS

  • Development of nano-structured coatings and foils for brazing and/or diffusion bonding at ever-lower temperatures in the range of 400 - 750°C (with subsequent operation of the produced joints at much higher temperatures > 750°C).

  • Development of reactive foil technologies for joining heat-sensitive (nano-)materials and electronic components.

  • Development and fabrication of nano-multilayered coatings and foils for time-effective Transient Liquid Phase (TLP) bonding processes producing high-quality joints (with e.g. low porosity).
 
Head of the laboratory
Group leader
Group members
 

Dr. Mirco Chiodi, Research Scientist

Nikola Gojkovic, Technician

Dr. Frank Moszner, PostDoc

Guests
 

Philipp Natzke, Guest PhD ETHZ

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